Three Days of Insightful, Thought-Provoking Content on Engineering IT Infrastructure Topics
This year’s DAC will have the Design Infrastructure Alley, a section of DAC devoted to the infrastructure required to design chips and systems. Â The premise for the DIA is pretty simple:
Every year we get together at DAC to talk about new tools and new methods to create more complex chips and systems. Â But we never talk about the infrastructure needed to use these new methods and tools. Â The Design Infrastructure Alley bridges the gap between potential and execution and allows IT Professionals, Engineers and EDA Suppliers to have a conversation about how best to enable Design.
Below is the speaking schedule for this year’s Inaugural Design Infrastructure Alley. Â We’re still working through some details regarding topic titles, and we do have one “surprise” guest which will be revealed soon. Â All of these speakers will be at the Design on Cloud Pavilion on the main Exhibit Floor. Â You can see the floorpan here to know where you’re going in advance.
| Monday June 25 | Tuesday June 26 | Wednesday June 27 | |
|---|---|---|---|
| 10:30-11:15 | Association of HPC Pros: Intro to DIA | Metrics.ca: Verification 3.0 -- Enabling Innovation via the Cloud | Dell EMC: Peeling the onion: how enterprise storage limits tool performance and what you need to do to fix it |
| 11:30-12:15 | Si2: Si2 OpenAccess—Design Infrastructure for the Future | Altair: Cloud for Cloud Skeptics | Pure Storage: Faster Time to Market: Eliminate Data Bottlenecks for EDA and AI Workloads |
| 12:30-1:15 | Microsoft / Azure: Why Cloud, Why Now? | Cadence: EDA on the Cloud: Are We Ready? | FootPrintKu PalPilot: Influencing Design Libraries with Cloud Automation |
| 1:30-2:15 | IC Manage: Hybrid Cloud Bursting – Run Existing Workflows in the Cloud without Retooling | Google: Moving EDA to the Cloud - a Google-on-Google story | TI: CPU Oversubscription in Compute Clouds |
| 2:30-3:15 | IBM: EDA on IBM Cloud | Univa: Towards a Strategic Deployment Pattern for the EDA Hybrid Cloud | Ellexus: Fast, Agile and Cloud Ready: How to make workflows faster and easier to move |
| 3:30-4:15 | ACM: Design for Security: A High-Level Synthesis Approach | AWS: Innovation at Cloud Speed for IoT, AI, and Semiconductor Design | Alibaba: Alibaba Eco-System Enable Your Business |
| 4:30-5:30 | Panel - Cloud: Cloud Computing for EDA: Pie in the Sky or Pie in the Face | Six Nines: Revolutionizing semiconductor design workflows with HPC in the cloud | SuSE: What Can Green Do For You? - "The software must be flexible, but the platform must be stable." |
CELUG Conference
The CELUG Meeting, focusing specifically on license topics which will occur on Tuesday, June 26 in room 3007 of Moscone West. Â You must register for this conference separately, and the cost is only $100 before June 8 and $150 afterwards.
Special thanks to our friends at OpenIT for sponsoring lunch at the CELUG Conference! Â Your generous donation is much appreciated!
| Time | Speaker |
|---|---|
| 9:00 - 9:30 | CELUG / HPC Pros Intro |
| 9:30 - 10:00 | Ansys |
| 10:00 - 10:30 | Mathworks |
| 10:30 - 11:00 | Mentor Graphics, a Siemens Business |
| 11:00 - 11:30 | Cadence |
| 11:30 - 12:00 | ESDA OS Roadmap |
| 12:00 - 12:45 | Lunch Break |
| 12:45 - 1:00 | ESD Alliance Update |
| 1:00 - 1:30 | Flexera, Flexnet Publisher |
| 1:30 - 2:00 | Flexnet Manager for Engineering Applications |
| 2:00 - 3:00 | Machine Certification Discussion |
| 3:00 - 4:00 | CELUG Only Session |
